Capacitors
Tutorial
Handling Procedure for Chip Capacitors
1. Large chips should
be handled with care as they are susceptible to chipping if
mishandled. Non-metallic tweezers are recommended for use in
handling them.
2. Chips
larger than 2520 are also susceptible to thermal shock and
expansion mismatch during the soldering process. To avoid such
stresses chips should receive a gradual preheat up to the solder
operating temperature. (Ramp rate approx. 2°C/sec.)
3. Voltage
breakdown across end terminations of the chips and between leads,
in the case of the leaded units, is dependant on many variables,
including surface cleanliness and humidity conditions in use. In
order to prevent flashover some components may be required to be
further protected by potting or by running in a dielectric fluid,
if operated near their rated voltage. In general 0.4KV mm-1
in air is considered a safe operating level. To reduce the risk of
flashover due to poor surface cleanliness and to limit the
likelihood of poor solderability, it is recommended that chip
capacitors are not handled with fingers.
4. For other
dielectrics, sizes and voltage ratings up to, and in excess of,
25kV please consult factory.
|
