Handling Procedure for Chip Capacitors

1. Large chips should be handled with care as they are susceptible to chipping if mishandled. Non-metallic tweezers are recommended for use in handling them.

2. Chips larger than 2520 are also susceptible to thermal shock and expansion mismatch during the soldering process. To avoid such stresses chips should receive a gradual preheat up to the solder operating temperature. (Ramp rate approx. 2°C/sec.)

3. Voltage breakdown across end terminations of the chips and between leads, in the case of the leaded units, is dependant on many variables, including surface cleanliness and humidity conditions in use. In order to prevent flashover some components may be required to be further protected by potting or by running in a dielectric fluid, if operated near their rated voltage. In general 0.4KV mm^-1 in air is considered a safe operating level. To reduce the risk of flashover due to poor surface cleanliness and to limit the likelihood of poor solderability, it is recommended that chip capacitors are not handled with fingers.

4. For other dielectrics, sizes and voltage ratings up to, and in excess of, 25kV please consult factory.