Microwave Design Notes - Additional Information
- Metallised Components
Metallisation Testing + Processing
Metallisation + Adhesion
The final silver thickness on our components is controlled to give a minimum thickness of
5 m.
This is measured accurately using X-ray techniques on each lot processed to ensure that this
minimum criteria is met.
Acceptance criteria is that the silver is not detached from the ceramic at less than 2 kg force on
a 1.6 mm diameter pin head soldered to the face of the components.
Solderability
All metallised components manufactured by Morgan Electro Ceramics are analysed to confirm
the solderability of the product prior to release of the product.
The acceptance criteria is met if the dipped surface of the parts are covered with solder with no
more than small amounts of scattered imperfections such as pin-holes or un-wetted or
de-wetted areas. These imperfections shall not be concentrated in one area.
Care should be taken when soldering ceramic components in order to avoid thermal shock.
Maximum temperature should not exceed 230°C for a short duration and components should not be
exposed to rapid heat or cooling.
The thick film silver that we
apply to our components can be readily processed through most standard reflow
processes, following the typical profile, as shown.
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